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ContactTransistor Sockets(21155)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Factory Lead Time | Number of Pins | Pbfree Code | Connector Type | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Lead Length | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Body Length or Diameter | Body Breadth | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 260-5204-01 | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | QFN | Textool™ | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/3m-260520401-datasheets-5425.pdf | QFN | 11 Weeks | Socket | 60 | 60 | Gold | Straight | Copper | Gold | Polyethersulfone (PES) | 25mOhm | Open Frame | 500μm | 60 (4 x 15) | Beryllium Copper | Beryllium Copper | 0.020 0.50mm | 0.114 2.90mm | 0.020 0.50mm | Gold | |||||||||||||||||||||||||||||
| 28-6572-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2016 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | 28 | yes | 28 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 28 (2 x 14) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 550-10-357M19-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 357 (19 x 19) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||
| 264-4205-00 | Artery |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Not Applicable | Solder | Non-RoHS Compliant | /files/3m-248420501-datasheets-2397.pdf | QFN | 11 Weeks | 64 | Female | Straight | 400μm | ||||||||||||||||||||||||||||||||||||||||||||||||
| 240-PRS20014-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 240 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 262-PLS20003-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 257-PRS20013-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | /files/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 257 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 514-87-520M31-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 520 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 520 (31 x 31) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||
| 523-93-441-21-000002 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 558-10-352M26-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 352 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||
| 324-PLS18001-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | yes | 324 | Gold | UL94 V-0 | EAR99 | Polyphenylene Sulfide (PPS) | 3.175mm | e3 | Closed Frame | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 514-87-504M29-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 504 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 504 (29 x 29) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||
| 257-PRS20018-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 257-PRS21015-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 257 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 550-10-360M19-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 360 (19 x 19) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||
| 558-10-357M19-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 357 (19 x 19) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||
| 550-10-388M26-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 388 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||
| 514-87-500M30-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 500 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 500 (30 x 30) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||
| 32-3574-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/aries-32357418-datasheets-3780.pdf | 1A | 6 Weeks | yes | 32 | 32 | Nickel Boron | UL94 V-0 | EAR99 | UL 94V-0 | Nickel | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 32 (2 x 16) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||
| 257-PLS20018-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 514-87-480M29-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 480 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 480 (29 x 29) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||
| 280-PRS19006-12 | Aries Electronics | $108.24 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/aries-280prs1900612-datasheets-3781.pdf | 1A | 5 Weeks | 280 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 48-6571-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | 250°C | -55°C | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | 48 | Nickel Boron | UL94 V-0 | Nickel | Polyetheretherketone (PEEK), Glass Filled | 2.794mm | Closed Frame | 1A | 48 (2 x 24) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||||||||||||||
| 280-PLS19006-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PLS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/aries-280pls1900612-datasheets-3782.pdf | 1A | 5 Weeks | 280 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 281-PRS18037-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 281 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 216-PRS21016-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | 216 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 36-6553-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | yes | 36 | Tin | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 250°C | 2.39 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 40 (2 x 20) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||
| 210-PRS19034-12 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA, ZIF (ZIP) | PRS | Through Hole | Through Hole | -65°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -65°C | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/arieselectronics-225prs1500112-datasheets-2299.pdf | 1A | 5 Weeks | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS) | 3.175mm | Closed Frame | 1A | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||
| 550-10-504M29-001166 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001166-datasheets-7079.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 504 (29 x 29) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.098 2.50mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||||||
| 244-5205-00 | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Not Applicable | Solder | Non-RoHS Compliant | /files/3m-248420501-datasheets-2397.pdf | QFN | 11 Weeks | 44 | Female | Straight | 500μm |
