Configuration Proms for FPGAs - Electronic Components Sourcing - Best Electronic Component Agent - ICGNT
Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Technology Operating Mode Height Seated (Max) RoHS Status Published Datasheet Package / Case Length Width Operating Supply Voltage Number of Terminations Number of Pins Pbfree Code ECCN Code Additional Feature Radiation Hardening Reach Compliance Code Number of Functions JESD-609 Code Terminal Finish Surface Mount Voltage - Supply Terminal Position Peak Reflow Temperature (Cel) Supply Voltage Terminal Pitch Base Part Number Pin Count Supply Voltage-Max (Vsup) Supply Voltage-Min (Vsup) Time@Peak Reflow Temperature-Max (s) Power Supplies Supply Current-Max Qualification Status Supplier Device Package Memory Size Output Characteristics Clock Frequency Organization Memory Width Memory Density Parallel/Serial Standby Current-Max I/O Type Memory IC Type Programmable Type
XC17S200APDG8I XC17S200APDG8I Xilinx
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0 0x0x0 download Through Hole -40°C~85°C Tube 1 (Unlimited) CMOS 4.5974mm RoHS Compliant 1999 /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 3.3V 8 8 yes EAR99 No 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC17S200A 8 3.6V 3V 30 0.015mA 2Mb 3-STATE 1 SERIAL 0.001A COMMON CONFIGURATION MEMORY OTP
XC1701LPDG8C XC1701LPDG8C Xilinx
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0 0x0x0 download Through Hole 0°C~70°C Tube 1 (Unlimited) CMOS SYNCHRONOUS 4.5974mm RoHS Compliant 2004 /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 8 8 yes USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC1701L 8 3.6V 3V 30 3.3V 0.01mA Not Qualified 1Mb 3-STATE 15MHz 1MX1 1 SERIAL 0.00005A COMMON CONFIGURATION MEMORY OTP
AT17LV002A-10CU AT17LV002A-10CU Microchip Technology
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0 0x0x0 download Surface Mount -40°C~85°C Tube 3 (168 Hours) ROHS3 Compliant 1997 /files/microchiptechnology-at17lv002a10cu-datasheets-4359.pdf 8-TDFN 3V~3.6V 4.5V~5.5V AT17LV002A 8-LAP (6x6) 2Mb Serial EEPROM
XC17S10XLPDG8C XC17S10XLPDG8C Xilinx
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0 0x0x0 download Through Hole 0°C~70°C Tube 1 (Unlimited) CMOS SYNCHRONOUS 4.5974mm RoHS Compliant 1999 /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 8 8 EAR99 unknown 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC17S10XL 8 3.6V 3V 30 3.3V 0.005mA Not Qualified 100kb 3-STATE 10MHz 95752X1 1 95752 bit 0.00005A COMMON MEMORY CIRCUIT OTP
XC1701LPDG8I XC1701LPDG8I Xilinx
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0 0x0x0 download Through Hole -40°C~85°C Tube 1 (Unlimited) CMOS SYNCHRONOUS 4.5974mm RoHS Compliant 2004 /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf 8-DIP (0.300, 7.62mm) 9.3599mm 7.62mm 8 8 yes EAR99 USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS unknown 1 e3 Matte Tin (Sn) NO 3V~3.6V DUAL 250 3.3V 2.54mm XC1701L 8 3.6V 3V 30 3.3V 0.01mA Not Qualified 1Mb 3-STATE 15MHz 1MX1 1 SERIAL 0.00005A COMMON CONFIGURATION MEMORY OTP
AT17N512-10PC AT17N512-10PC Microchip Technology
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0 0x0x0 download Through Hole 0°C~70°C Tube 1 (Unlimited) Non-RoHS Compliant 1997 /files/microchiptechnology-at17n51210pc-datasheets-4369.pdf 8-DIP (0.300, 7.62mm) 3V~3.6V AT17N512 8-PDIP 512kb Serial EEPROM
AT17N256-10PI AT17N256-10PI Microchip Technology
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0 0x0x0 download Through Hole -40°C~85°C Tube 1 (Unlimited) Non-RoHS Compliant 1997 /files/microchiptechnology-at17n25610pi-datasheets-4303.pdf 8-DIP (0.300, 7.62mm) 3V~3.6V AT17N256 8-PDIP 256Kb Serial EEPROM

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